Please use this identifier to cite or link to this item: http://www.repository.rmutt.ac.th/xmlui/handle/123456789/1417
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dc.contributor.authorPassapong Wutimakun
dc.contributor.authorKaman Chaivanich
dc.contributor.authorTheerachol Mahawan
dc.contributor.authorThongkam Chumpol
dc.contributor.authorWinat Intarasuwan
dc.contributor.authorChumpol Buteprongjit
dc.date.accessioned2014-02-24T08:19:43Z
dc.date.accessioned2020-09-24T04:33:23Z-
dc.date.available2014-02-24T08:19:43Z
dc.date.available2020-09-24T04:33:23Z-
dc.date.issued2554
dc.identifier.issn1685-5280
dc.identifier.urihttp://www.repository.rmutt.ac.th/dspace/handle/123456789/1417-
dc.description.abstractA long-wavelength infrared thermal imaging camera was applied to visually evaluate the thermal influence of defects in SiC substrates. Defects in substrates were rapidly and effectively detected by IR camera observation, and the dependence of the temperature on the defect size could be observed precisely. IR camera was applied to show clearly the change in heat propagation in areas of defects in SiC substrates by observation of temperature distribution images in real time. Consequently, the IR camera can be considered as an effective technique for evaluating the thermal influence of defects.en_US
dc.language.isoenen_US
dc.publisherChulachomklao Royal Military Academy. Department of Industrial Engineering.en_US
dc.relation.ispartofseriesJournal of Engineering, RMUTT;Volume 9 Issue 2, July - December 2011
dc.subjectSiCen_US
dc.subjectIR cameraen_US
dc.subjectdefecten_US
dc.subjectheat propagationen_US
dc.subjecttemperature distribution imageen_US
dc.titleStudies on Defect Detection and Thermal Influence in SiC Substrates Using an IR Thermal Imaging Cameraen_US
dc.typeArticleen_US
Appears in Collections:บทความ (Article - EN)

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